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LaserLinc, Inc.: precision, non-contact, measurement and control solutions for wire, cable, hose, tube, pipe, and other products in medical, automotive, aerospace, energy, metrology and other industries

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Home > Applications > Identify Defects with Constant In-Process Monitoring

Identify Defects with Constant In-Process Monitoring

A flaw is a short-term anomaly in the product. A lump is an oversized flaw; a neckdown is an undersized flaw. Defects may be cosmetic, or they may affect product performance or usability, but they must be identified and removed before reaching the customer or downstream processes.

Contact us to learn more about how our products can help you meet your objectives.

LaserLinc’s processor platforms, Total Vu™ software and the SmartLinc™ processor, each independently and simultaneously analyze data for measurements and defects. Using one device for measuring and detecting defects saves money, saves space on the production line, simplifies installation, and reduces maintenance costs. LaserLinc’s three-axis high-speed scanning laser micrometers are ideally suited for this dual-purpose use.

Detect then Eliminate Defects

To detect a flaw, the product diameter is compared to upper and lower limits, the immediately preceding measurement, or both. Flaw detection can be performed on wall thickness as well. Details of each flaw are recorded electronically and can be printed. Flaws can also trigger a marking device, cutter, or other device when detected. Once identified, you can take steps to ensure that defects do not reach your customer.

What Defects Can You Catch?

Five factors determine whether scanning flaw detection is capable of identifying a flaw. Download this white paper to learn more.

Other Ways to Capture Defects

The Total Vu platform offers two other ways of tracking defects: data logging and Event Characterization.

Data logging captures measurement values to disk in comma separated values (CSV) format or tab delimited format. A special mode of logging captures only out-of-tolerance readings. Each record is time, date, and [optionally] length stamped.

The Event Characterization option captures measurement data up to the full measurement rate of the source micrometer (for example, at 12,000 measurements per second with a Triton331™ micrometer). Data is captured before, during, and after points of interest such as a defect. You get maximum measurement frequency using a minimal amount of storage and it saves time in post-processing.